Hochiminh Stock Exchange announces the record date for bond interest and principal payment as follows:
- Bond name: Bond of Ho Chi Minh City Infrastructure Investment Joint Stock Company (CII_BOND2017-03)
- Bond code: CII11709
- ISIN code: VN0CII117096
- Bond type: corporate bond
- Par value: VND100,000
- Bond term: 02 years
- Issue date: July 26, 2017
- Maturity date: July 26, 2019
- Purpose: to pay interest (from April 26, 2019 to July 26, 2019) and principal on the maturity date of July 26, 2019.
- Payment amount: VND101,953/bond
- Record date: July 12, 2019
- Payment date: July 26, 2019
- Place of payment:
- For bondholders whose bonds have been deposited: Bondholders will fulfill procedures to receive bond interest and principal at the securities firms where the bonds have been deposited.
- For bondholders whose bonds have not been deposited: The bond interest and principal will be paid to the bondholders’ accounts which were registered at Ho Chi Minh City Securities Corporation (Floor 5-6, AB Building, 76 Le Lai, district 1, HCMC) from July 26, 2019.