Ho Chi Minh City Infrastructure Investment Joint Stock Company (CII) announces the record date for bond interest payment (from 01/27/2019 to 07/28/2019) and principal payment of CII072019 bond (code: CII11803) on the maturity date, as follows:

-       Record date for the bond interest and principal payment: July 15, 2019

-       Payment date of interest and principal: July 29, 2019 (because the date of July 28, 2019 is Sunday).

-       Place of payment:

• For the bondholders whose bonds have been deposited: Bondholders will complete procedures to receive interest and principal at the securities firms where the bonds have been deposited.
• For the bondholders whose bonds have not been deposited: The interest and principal of CII11803 will be paid to the accounts that bondholders registered at Techcom Securities Joint Stock Company on July 29, 2019.