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 CII11803: Notice of payment of principal and interest payment
HSX - 7/2/2019 1:50:00 PM
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Ho Chi Minh City Infrastructure Investment Joint Stock Company (CII) announces the record date for bond interest payment (from 01/27/2019 to 07/28/2019) and principal payment of CII072019 bond (code: CII11803) on the maturity date, as follows:
- Record date for the bond interest and principal payment: July 15, 2019
- Payment date of interest and principal: July 29, 2019 (because the date of July 28, 2019 is Sunday).
- Place of payment:
- For the bondholders whose bonds have been deposited: Bondholders will complete procedures to receive interest and principal at the securities firms where the bonds have been deposited.
- For the bondholders whose bonds have not been deposited: The interest and principal of CII11803 will be paid to the accounts that bondholders registered at Techcom Securities Joint Stock Company on July 29, 2019.
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