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THI: BOD resolution on the plan for private placement of bonds
HSX - 2/1/2019 4:29:00 PM
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On January 30, 2019, the Board of Directors of Electrical Equipment Joint Stock Company approved the plan for private placement of bonds as follows:

-       Stock name: Electrical Equipment Joint Stock Company

-       Bond term: 03 years

-       Par value: VND100,000,000/bond

-       Issue volume: 5,500 bonds

-       Total value (based on par value): VND550,000,000,000

-       Interest rate:

+ Interest rate for first 3 months from the issue date: 10.5%/year

+ Interest rate for next periods: reference interest + 3.5%/year

-       Interest payment period: once every 06 months

-       Interest adjustment period: once every 03 months

-       Issue date: expected in Q1.2019

-       Issue date: expected about 03 years from the issue date

-       Consulting company: IB Securities Joint Stock Company

-       Bank for blocking depository money: Tien Phong Commercial Joint Stock Bank

-       Issue method: private placement.

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